Method for manufacturing junction semiconductor device

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C438S680000, C438S700000, C438S931000, C257SE21170, C257SE21077, C257SE21115, C257SE21129, C257SE21218, C257SE21229, C257SE21248, C257SE21319

Reexamination Certificate

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07867836

ABSTRACT:
A method for manufacturing a junction semiconductor device having a drain region including a low-resistance layer of a first conductive type formed on one surface of a semiconductor crystal, a source region including a low-resistance layer of a first conductive type formed on the other surface of the semiconductor crystal, a gate region of a second conductive type formed on the periphery of the source region, a high-resistance layer of a first conductive type between the source region and the drain region, and a recombination-inhibiting semiconductor layer of a second conductive type provided in the vicinity of the surface of the semiconductor crystal between the gate region and the source region.

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J. H. Zhao et al., 6A, 1kV 4H-SIC Normally-off Trenched-and-Implanted Vertical JFETs, Materials Science Forum, 2004, 1213-1216, 457-460, Trans Tech Publications, Switzerland.
Takahashi Shinohe et al., 600V5A 4H-SIC with Low RonS of 13mΩcm2, Proceedings of the Symposium on Static Induction Devices, 2002, 41-45, 17.

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