Etching a substrate: processes – Forming or treating thermal ink jet article
Reexamination Certificate
2006-03-06
2008-05-06
Tran, Binh X. (Department: 1792)
Etching a substrate: processes
Forming or treating thermal ink jet article
C216S058000, C216S075000, C216S079000, C216S089000
Reexamination Certificate
active
07368063
ABSTRACT:
In an ink-jet printhead and a method for manufacturing the same, the ink-jet printhead includes a substrate, an ink chamber to be filled with ink formed on a front surface of the substrate, a manifold for supplying ink to the ink chamber formed on a rear surface of the substrate, and an ink passage in flow communication with the ink chamber and the manifold formed parallel to the front surface of the substrate; a nozzle plate including a plurality of passivation layers formed of an insulating material on the front surface of the substrate, a heat dissipating layer formed of a metallic material, and a nozzle in flow communication with the ink chamber; and a heater and a conductor, the heater being positioned on the ink chamber and heating ink in the ink chamber, and the conductor for applying a current to the heater.
REFERENCES:
patent: 4275290 (1981-06-01), Cielo et al.
patent: 4639748 (1987-01-01), Drake et al.
patent: 5502471 (1996-03-01), Obermeier et al.
patent: 5565084 (1996-10-01), Lee et al.
patent: 5734399 (1998-03-01), Weber et al.
patent: 5841452 (1998-11-01), Silverbrook
patent: 5855835 (1999-01-01), Gordon et al.
patent: 5859654 (1999-01-01), Radke et al.
patent: 5880759 (1999-03-01), Silverbrook
patent: 6019457 (2000-02-01), Silverbrook
patent: 6102530 (2000-08-01), Kim et al.
patent: 6260957 (2001-07-01), Corley, Jr. et al.
patent: 6286941 (2001-09-01), Courian et al.
patent: 6336714 (2002-01-01), Kawamura et al.
patent: 6382782 (2002-05-01), Anagnostopoulos et al.
patent: 6402972 (2002-06-01), Weber et al.
patent: 6412918 (2002-07-01), Chen et al.
patent: 6423241 (2002-07-01), Yoon et al.
patent: 6533399 (2003-03-01), Lee et al.
patent: 6561625 (2003-05-01), Maeng et al.
patent: 6561626 (2003-05-01), Min et al.
patent: 2002/0129495 (2002-09-01), Trueba et al.
patent: 2002/0149650 (2002-10-01), Cruz-Uribe et al.
patent: 2003/0085957 (2003-05-01), Huang et al.
patent: 2003/0160842 (2003-08-01), Min et al.
patent: 0 924 077 (1999-06-01), None
patent: 1 174 268 (2002-01-01), None
patent: 1 215 048 (2002-06-01), None
patent: 1 216 837 (2002-06-01), None
patent: 1 221 374 (2002-07-01), None
patent: 1 226 946 (2002-07-01), None
patent: 1 413 438 (2004-04-01), None
patent: 2002 036562 (2002-02-01), None
Baek Seog-soon
Kim Min-soo
Lim Hyung-taek
Oh Yong-soo
Shin Jong-woo
Lee & Morse P.C.
Samsung Electronics Co,. Ltd.
Tran Binh X.
LandOfFree
Method for manufacturing ink-jet printhead does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for manufacturing ink-jet printhead, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for manufacturing ink-jet printhead will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3986683