Method for manufacturing high-stability resistors, such as...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S632000, C257SE21035, C257SE23116

Reexamination Certificate

active

08030712

ABSTRACT:
A method for protecting a circuit component on a semiconductor substrate from a plasma etching or other removal process includes forming a screening layer over an auxiliary layer to conceal at least an area of the auxiliary layer that overlays at least a portion of the circuit component, such as for example a high-ohmic poly resistor. The method transfers a pattern defined by a mask onto the screening layer by selectively removing portions of the screening layer in accordance with the pattern. Portions of the auxiliary layer that are not protected by the screening layer are removed using a plasma gas selective to the auxiliary layer material, without removing the area of the auxiliary layer that overlays the portion of the circuit component, thereby protecting the circuit component from the plasma gas via the screening layer and auxiliary layer.

REFERENCES:
patent: 5187122 (1993-02-01), Bonis
patent: 5656524 (1997-08-01), Eklund et al.
patent: 5825058 (1998-10-01), Suga
patent: 6797554 (2004-09-01), Katayama
patent: 7338852 (2008-03-01), Hsu
patent: 2005/0170596 (2005-08-01), Kim

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for manufacturing high-stability resistors, such as... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for manufacturing high-stability resistors, such as..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for manufacturing high-stability resistors, such as... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4298217

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.