Method for manufacturing differential isolation structures...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C438S258000, C438S259000, C438S287000, C438S735000, C438S769000, C257S296000, C257S410000, C257S411000, C257SE21625, C257SE21639, C257SE27081

Reexamination Certificate

active

07820504

ABSTRACT:
Embodiments of this invention relate to a method for manufacturing isolation structures with different depths in a monolithically integrated semiconductor electronic device. An inventive method according to an embodiment of the invention comprises a first step of defining active areas on a semiconductor material substrate, a second step of forming isolation structures by realising trenches in said substrate and then filling them with field oxide, a third step of defining lithographically at least a first device area, and a fourth step of realising a digging in the substrate and in the field oxide of said first device area.

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patent: 5889335 (1999-03-01), Kuroi et al.
patent: 6181018 (2001-01-01), Saino
patent: 6380020 (2002-04-01), Shimizu
patent: 6391720 (2002-05-01), Sneelal et al.
patent: 6653675 (2003-11-01), Gonzalez et al.
patent: 6773999 (2004-08-01), Yoneda
patent: 7042064 (2006-05-01), Beasom
patent: 2002/0093071 (2002-07-01), Chheda et al.
European Search Report, EP03425459, Mar. 26, 2004.

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