Method for manufacturing an electrode structure of a MOS...

Semiconductor device manufacturing: process – Introduction of conductivity modifying dopant into... – Diffusing a dopant

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S530000

Reexamination Certificate

active

07579264

ABSTRACT:
A method for manufacturing a semiconductor device includes the steps of forming a first insulating film over a semiconductor substrate, forming a laminated body on the first insulating film that includes a polysilicon film and a metal film that is separated from the insulating film by means of the polysilicon film, and forming a first wiring layer and a first electrode simultaneously by patterning the laminated body.

REFERENCES:
patent: 5232861 (1993-08-01), Miwa
patent: 5449637 (1995-09-01), Saito et al.
patent: 5472887 (1995-12-01), Hutter et al.
patent: 5604143 (1997-02-01), Ishida et al.
patent: 6165880 (2000-12-01), Yaung et al.
patent: 6235574 (2001-05-01), Tobben et al.
patent: 6309921 (2001-10-01), Ema et al.
patent: 6511883 (2003-01-01), Pan et al.
patent: 6946335 (2005-09-01), Ip et al.
patent: 6972221 (2005-12-01), Takahashi
patent: 7265011 (2007-09-01), Yoon et al.
patent: 2004/0185611 (2004-09-01), Berthold et al.
patent: 2005/0048729 (2005-03-01), Yoon et al.
patent: 2006/0014389 (2006-01-01), Osanai
patent: 4/74426 (1992-03-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for manufacturing an electrode structure of a MOS... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for manufacturing an electrode structure of a MOS..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for manufacturing an electrode structure of a MOS... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4095582

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.