Method for manufacturing a thin film transistor using poly...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer

Reexamination Certificate

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C438S197000, C438S198000

Reexamination Certificate

active

10499090

ABSTRACT:
A manufacturing method of a thin film transistor. An amorphous silicon thin film is formed on an insulating substrate, and is crystallized by a lateral solidification process with illumination of laser beams into the amorphous silicon thin film to form a polysilicon thin film. Next, protrusion portions protruding from the surface of the polysilicon thin film are removed by plasma dry-etching using a gas mixture including Cl2, SF6and Ar at the ratio of 3:1:2 to smooth the surface of the polysilicon thin film, and the semiconductor layer is formed by patterning the polysilicon thin film. A gate insulating film covering the semiconductor layer is formed and a gate electrode is formed on the gate insulating film opposite the semiconductor layer. A source region and a drain region opposite each other with respect to the gate electrode are formed by implanting impurities into the semiconductor layer and a source electrode and drain electrode are formed to be electrically connected to the source region and drain region.

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English Abstract for JP 09-213630.
English Abstract for JP 2000-353811.
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English Abstract for JP 2000-133634.
English Abstract for JP 2001-142094.

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