Method for manufacturing a gate sidewall spacer using an...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C438S299000, C438S303000, C438S308000, C438S653000, C438S689000, C257SE21293

Reexamination Certificate

active

07465635

ABSTRACT:
The present invention provides a method for manufacturing a semiconductor device. The method for manufacturing the semiconductor device, among other steps, may include forming a gate structure over a substrate, forming at least a portion of gate sidewall spacers proximate sidewalls of the gate structure, and subjecting the at least a portion of the gate sidewall spacers to an energy beam treatment, the energy beam treatment configured to change a stress of the at least a portion of the gate sidewall spacers, and thus change a stress in the substrate therebelow.

REFERENCES:
patent: 7002209 (2006-02-01), Chen et al.
patent: 7005357 (2006-02-01), Ngo et al.
patent: 2006/0014366 (2006-01-01), Currie
patent: 2006/0105106 (2006-05-01), Balseanu et al.
patent: 2006/0244074 (2006-11-01), Chen et al.

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