Method for manufacturing a bump on a semiconductor chip

Details Method for manufacturing a bump on a semiconductor chip Method for manufacturing a bump on a semiconductor chip

1994-07-15

1995-05-23

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437182, 437192, 437203, H01L 2144

Patent

active

054181860

ABSTRACT:
A method for manufacturing a bump on a semiconductor comprising the steps of: forming metal pad on a portion of a surface of a substrate, forming a barrier metal layer over the surface of the substrate such that the barrier metal layer cover the metal pad, forming a photoresist layer over the barrier metal layer, forming an opening in the photoresist layer to expose a portion of the barrier metal layer overlaying the metal pad, forming a chip bump in the opening, selectively removing the photoresist layer using the bump as a mask, such that residual portions of the photoresist layer remain, and such that portions of the barrier metal layer are exposed, etching the exposed portions of the barrier metal layer using the residual photoresist layer as a mask, and removing the residual photoresist layer.

REFERENCES:
patent: 4948754 (1990-08-01), Kondo et al.
patent: 5057453 (1991-10-01), Endo et al.
patent: 5244833 (1993-09-01), Gansauge et al.
patent: 5298459 (1994-03-01), Arikawa et al.
patent: 5300445 (1994-04-01), Oku

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