Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2007-10-09
2007-10-09
Chambliss, Alonzo (Department: 2814)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S118000, C438S126000, C257S685000, C257S686000, C257S784000
Reexamination Certificate
active
11374468
ABSTRACT:
A semiconductor multi-package module having stacked lower and upper packages, each package including a die attached to a substrate, in which the upper and lower substrates are interconnected by wire bonding. Also, a method for making a semiconductor multi-package module, by providing a lower molded package including a lower substrate and a die, affixing an upper molded package including an upper substrate onto the upper surface of the lower package, and forming z-interconnects between the upper and lower substrates.
REFERENCES:
patent: 5222014 (1993-06-01), Lin
patent: 5229960 (1993-07-01), De Givry
patent: 5340771 (1994-08-01), Rostoker
patent: 5373189 (1994-12-01), Massit et al.
patent: 5436203 (1995-07-01), Lin
patent: 5495398 (1996-02-01), Takiar et al.
patent: 5550711 (1996-08-01), Burns et al.
patent: 5652185 (1997-07-01), Lee
patent: 5898219 (1999-04-01), Barrow
patent: 5899705 (1999-05-01), Akram
patent: 5903049 (1999-05-01), Mori
patent: 5977640 (1999-11-01), Bertin et al.
patent: 6025648 (2000-02-01), Takahashi et al.
patent: 6034875 (2000-03-01), Heim et al.
patent: 6075289 (2000-06-01), Distefano
patent: 6118176 (2000-09-01), Tao et al.
patent: 6133626 (2000-10-01), Hawke et al.
patent: 6201266 (2001-03-01), Ohuchi et al.
patent: 6201302 (2001-03-01), Tzu
patent: 6274930 (2001-08-01), Vaiyapuri et al.
patent: 6316838 (2001-11-01), Ozawa et al.
patent: 6333552 (2001-12-01), Kakimoto et al.
patent: 6340846 (2002-01-01), LoBianco et al.
patent: 6376904 (2002-04-01), Haba et al.
patent: 6388313 (2002-05-01), Lee et al.
patent: 6400007 (2002-06-01), Wu et al.
patent: 6414381 (2002-07-01), Takeda
patent: 6424050 (2002-07-01), Komiyama
patent: 6441498 (2002-08-01), Song
patent: 6445064 (2002-09-01), Ishii et al.
patent: 6472732 (2002-10-01), Terui
patent: 6472741 (2002-10-01), Chen et al.
patent: 6489676 (2002-12-01), Taniguchi et al.
patent: 6492726 (2002-12-01), Quek et al.
patent: 6501165 (2002-12-01), Farnworth
patent: 6538319 (2003-03-01), Terui
patent: 6545365 (2003-04-01), Kondo et al.
patent: 6552423 (2003-04-01), Song et al.
patent: 6555902 (2003-04-01), Lo et al.
patent: 6570249 (2003-05-01), Liao et al.
patent: 6583503 (2003-06-01), Akram et al.
patent: 6593647 (2003-07-01), Ichikawa
patent: 6593662 (2003-07-01), Pu et al.
patent: 6599779 (2003-07-01), Shim et al.
patent: 6611063 (2003-08-01), Ichinose et al.
patent: 6621169 (2003-09-01), Kikuma et al.
patent: 6621172 (2003-09-01), Nakayama et al.
patent: 6650019 (2003-11-01), Glenn et al.
patent: 6690089 (2004-02-01), Uchida
patent: 6700178 (2004-03-01), Chen et al.
patent: 6706557 (2004-03-01), Koopmans
patent: 6737750 (2004-05-01), Hoffman et al.
patent: 6762488 (2004-07-01), Maeda et al.
patent: 6777799 (2004-08-01), Kikuma et al.
patent: 6787915 (2004-09-01), Uchida et al.
patent: 6787916 (2004-09-01), Halahan
patent: 6794749 (2004-09-01), Akram
patent: 6828665 (2004-12-01), Pu et al.
patent: 6847105 (2005-01-01), Koopmans
patent: 6864566 (2005-03-01), Choi
patent: 6882057 (2005-04-01), Hsu
patent: 6890798 (2005-05-01), McMahon
patent: 6900528 (2005-05-01), Mess et al.
patent: 6930378 (2005-08-01), St. Amand et al.
patent: 6930396 (2005-08-01), Kurita et al.
patent: 6933598 (2005-08-01), Karnezos
patent: 7034387 (2006-04-01), Karnezos
patent: 7045887 (2006-05-01), Karnezos
patent: 7049691 (2006-05-01), Karnezos
patent: 7053476 (2006-05-01), Karnezos
patent: 7053477 (2006-05-01), Karnezos
patent: 7057269 (2006-06-01), Karnezos
patent: 7061088 (2006-06-01), Karnezos
patent: 7064426 (2006-06-01), Karnezos
patent: 7071568 (2006-07-01), St. Amand et al.
patent: 7081678 (2006-07-01), Liu
patent: 7119427 (2006-10-01), Kim
patent: 2002/0096755 (2002-07-01), Fukui et al.
patent: 2002/0130404 (2002-09-01), Ushijima et al.
patent: 2003/0113952 (2003-06-01), Sambasivam et al.
patent: 2003/0153134 (2003-08-01), Kawata et al.
patent: 2004/0016939 (2004-01-01), Akiba et al.
patent: 2004/0061213 (2004-04-01), Karnezos
patent: 2004/0212096 (2004-10-01), Wang
patent: 2006/0043556 (2006-03-01), Su et al.
patent: 2006/0138631 (2006-06-01), Tao et al.
patent: 05152505 (1993-06-01), None
patent: 2001223326 (2001-08-01), None
Chambliss Alonzo
Chippac Inc.
LandOfFree
Method for making a semiconductor multi-package module... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for making a semiconductor multi-package module..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for making a semiconductor multi-package module... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3875806