Method for making a semiconductor device having a high-k...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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Reexamination Certificate

active

06709911

ABSTRACT:

FIELD OF THE INVENTION
The present invention relates to methods for making semiconductor devices, in particular, semiconductor devices that include high-k gate dielectric layers.
BACKGROUND OF THE INVENTION
MOS field-effect transistors with very thin silicon dioxide based gate dielectrics may experience unacceptable gate leakage currents. Forming the gate dielectric from certain high-k dielectric materials, instead of silicon dioxide, can reduce gate leakage. Such a dielectric may not, however, be compatible with polysilicon—the preferred material for making the device's gate electrode.
The electron mobility on high-k films may be notably inferior to the electron mobility on silicon dioxide or silicon oxynitride films. In addition, when such a high-k film comprises an oxide, it may manifest oxygen vacancies and excess impurity levels. Oxygen vacancies may permit undesirable interaction between the high-k film and the gate electrode. When the gate electrode comprises polysilicon, such interaction may alter the electrode's workfunction or cause the device to short through the dielectric.
Accordingly, there is a need for an improved process for making a semiconductor device that includes a high-k gate dielectric. There is a need for such a process for producing a device that demonstrates acceptable electron mobility on the gate dielectric. There is a need for a process for forming a very thin high-k gate dielectric that improves the interface between the high-k film and the gate electrode by minimizing oxygen vacancies in the high-k film. The method of the present invention provides such a process.


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