Method for machining a workpiece on a workpiece support

Details Method for machining a workpiece on a workpiece support Method for machining a workpiece on a workpiece support

2011-02-22

2011-02-22

Picardat, Kevin M (Department: 2822)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

Thinning of semiconductor substrate

C438S455000, C438S456000, C438S458000, C438S977000, C414S935000, C414S936000, C414S939000, C414S941000

Reexamination Certificate

active

07892947

ABSTRACT:
A workpiece machining method includes attaching a workpiece to a workpiece support with the aid of joining means. The workpiece and the workpiece support are joined to one another by an annular joining means. The composite produced is machined. The machined workpiece is separated from the workpiece support.

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Office Action in the China Patent Office, dated Aug. 28, 2009, for corresponding Chinese application No. 200810186369.0.
Unpublished Japanese priority document for U.S. 7,115,485, filed in Japan on Sep. 26, 2003, English translation provided.

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