Method for joining lead frames in a package assembly, method...

Details Method for joining lead frames in a package assembly, method... Method for joining lead frames in a package assembly, method...

2006-12-12

2006-12-12

Everhart, Caridad (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S123000, C257SE21500

Reexamination Certificate

active

07148080

ABSTRACT:
A method for joining lead frames in a chip stack package or a package stack, a chip stack package, and a method of forming a chip stack package. A joining mediator is formed on joining portions of at least one lead frame. The joining mediator has an anti-oxidation property and an inter-metallic diffusion property, and may be formed of gold wires, gold bumps, gold bars, solder bumps, solder, or solder bars. By clamping or compressing the lead frames under heat and pressure, the joining mediator forms an inter-metallic joint layer that reliably interconnects the lead frames at the joining portions.

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