4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Lead frame
  6. With bumps on ends of lead fingers to connect to semiconductor

Pyoung Wan Kim

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Method for joining lead frames in a package assembly, method...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Ultra-thin semiconductor package device using a support tape

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2543488

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