Method for integrating a SONOS gate oxide transistor into a...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C438S287000, C438S288000, C438S591000, C438S761000, C438S763000, C438S954000, C438S981000

Reexamination Certificate

active

06946349

ABSTRACT:
A method for integrating a SONOS device with an improved top oxide with SiO2gate oxides of different thickness is described. In a first embodiment during ISSG oxidation to form the SiO2gate oxides, a thin sacrificial silicon nitride layer is used over the top oxide of the ONO to minimize loss and to control the top oxide thickness. In a second embodiment the top oxide layer for the SONOS device is formed by depositing an NO stack. During ISSG oxidation to form the SiO2gate oxides a portion of the Si3N4in the NO stack is converted to SiO2to form the top oxide with improved thickness control.

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