Method for inspecting electronic devices mounted on a circuit bo

Details Method for inspecting electronic devices mounted on a circuit bo Method for inspecting electronic devices mounted on a circuit bo

1991-11-07

1992-11-24

Evans, F. L.

Optics: measuring and testing

By configuration comparison

With comparison to master, desired shape, or reference voltage

356375, 356376, 358101, 358106, G01B 1124

Patent

active

051667533

ABSTRACT:
A method of inspecting an electronic device soldered on a circuit board including the steps of (a) observing an electronic device to be inspected using a camera; (b) judging whether the electronic device is properly mounted, on the basis of the observation conducted in step (a); (c) observing the soldering state of the electronic device which has been judged in step (b) to be properly mounted using the camera; (d) judging whether said electronic device is properly soldered, on the basis of the observation conducted in step (c); (e) irradiating a laser beam toward a soldered portion of an electronic device which has been judged in step (d) to be improperly soldered; (f) receiving a laser beam reflected from the soldered portion and measuring a shape of the soldered portion using the received laser beam; and (g) judging whether the electronic device is properly soldered on the basis of the measurement conducted in step (f).

REFERENCES:
patent: 4028728 (1977-06-01), Sharp
patent: 4771125 (1988-09-01), Yoshimura et al.
patent: 4863268 (1989-09-01), Clarke et al.
patent: 4872052 (1989-10-01), Liudzius et al.
patent: 5027418 (1991-06-01), Ikegaya et al.

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