Method for increasing latch-up immunity in CMOS devices

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

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438221, 438222, 438223, 438433, 438524, 148DIG40, 148DIG50, 148DIG85, 148DIG86, 257371, 257374, 257520, H01L 21336

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active

057705046

ABSTRACT:
The preferred embodiment of the present invention overcomes the limitations of the prior art and provides a device and method to increase the latch-up immunity of CMOS devices by reducing the mobility of carriers between the devices. The preferred embodiment uses an implant formed beneath trench isolation between n-channel and p-channel devices. This implant preferably comprises relatively large/heavy elements implanted into the wafer beneath the trench isolation. The implant elements reduce the mobility of the charge carriers. This increases the latch-up holding voltage and thus reduces the likelihood of latch-up. The implants can be formed without the need for additional photolithography masks.

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