Method for improving a semiconductor device delamination...

Details Method for improving a semiconductor device delamination... Method for improving a semiconductor device delamination...

2004-07-03

2008-11-25

Luu, Chuong A. (Department: 2892)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S624000, C438S644000, C438S654000

Reexamination Certificate

active

07456093

ABSTRACT:
A semiconductor device with improved resistance to delamination and method for forming the same the method including providing a semiconductor wafer comprising a metallization layer with an uppermost etch stop layer; forming at least one adhesion promoting layer on the etch stop layer; and, forming an inter-metal dielectric (IMD) layer on the at least one adhesion promoting layer.

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