Semiconductor device manufacturing: process – Chemical etching – Combined with coating step
Reexamination Certificate
2005-06-21
2005-06-21
Norton, Nadine G. (Department: 1765)
Semiconductor device manufacturing: process
Chemical etching
Combined with coating step
C438S708000, C438S709000, C438S714000, C438S718000, C438S725000
Reexamination Certificate
active
06908861
ABSTRACT:
A lithography process for creating patterns in an activating light curable liquid using electric fields followed by curing of the activating light curable liquid is described. The process involves the use of a template that is formed of non-conductive and electrically conductive portions. The template is brought into close proximity to the activating light curable liquid on the substrate. An external electric field is applied to the template-substrate interface while maintaining a uniform, carefully controlled gap between the template and substrate. This causes the activating light curable liquid to be attracted to the raised portions of the template. Activating light is applied to the curable liquid while an electric field is applied to the template to create a patterned layer on the substrate.
REFERENCES:
patent: 3783520 (1974-01-01), King
patent: 4070116 (1978-01-01), Frosch et al.
patent: 4119688 (1978-10-01), Hiraoka
patent: 4201800 (1980-05-01), Alcorn et al.
patent: 4426247 (1984-01-01), Tamamura et al.
patent: 4507331 (1985-03-01), Hiraoka
patent: 4512848 (1985-04-01), Deckman et al.
patent: 4552833 (1985-11-01), Ito et al.
patent: 4600309 (1986-07-01), Fay
patent: 4657845 (1987-04-01), Frechet et al.
patent: 4692205 (1987-09-01), Sachdev et al.
patent: 4707218 (1987-11-01), Giammarco et al.
patent: 4731155 (1988-03-01), Napoli et al.
patent: 4737425 (1988-04-01), Lin et al.
patent: 4808511 (1989-02-01), Holmes
patent: 4826943 (1989-05-01), Ito et al.
patent: 4848911 (1989-07-01), Uchida et al.
patent: 4857477 (1989-08-01), Kanamori
patent: 4891303 (1990-01-01), Garza et al.
patent: 4908298 (1990-03-01), Hefferon et al.
patent: 4919748 (1990-04-01), Bredbenner et al.
patent: 4921778 (1990-05-01), Thackeray et al.
patent: 4931351 (1990-06-01), McColgin et al.
patent: 4964945 (1990-10-01), Calhoun
patent: 4976818 (1990-12-01), Hashimoto et al.
patent: 4980316 (1990-12-01), Huebner
patent: 4999280 (1991-03-01), Hiraoka
patent: 5028366 (1991-07-01), Harakal et al.
patent: 5053318 (1991-10-01), Gulla et al.
patent: 5071694 (1991-12-01), Uekita et al.
patent: 5074667 (1991-12-01), Miyatake
patent: 5108875 (1992-04-01), Thackeray et al.
patent: 5148036 (1992-09-01), Matsugu et al.
patent: 5148037 (1992-09-01), Suda et al.
patent: 5151754 (1992-09-01), Ishibashi et al.
patent: 5169494 (1992-12-01), Hashimoto et al.
patent: 5173393 (1992-12-01), Sezi et al.
patent: 5179863 (1993-01-01), Uchida et al.
patent: 5198326 (1993-03-01), Hashimoto et al.
patent: 5212147 (1993-05-01), Sheats
patent: 5234793 (1993-08-01), Sebald et al.
patent: 5240878 (1993-08-01), Fitzsimmons et al.
patent: 5242711 (1993-09-01), DeNatale et al.
patent: 5244818 (1993-09-01), Jokerst et al.
patent: 5314772 (1994-05-01), Kozicki et al.
patent: 5318870 (1994-06-01), Hartney
patent: 5324683 (1994-06-01), Fitch et al.
patent: 5328810 (1994-07-01), Lowrey et al.
patent: 5330881 (1994-07-01), Sidman et al.
patent: 5362606 (1994-11-01), Hartney et al.
patent: 5366851 (1994-11-01), Novembre
patent: 5374454 (1994-12-01), Bickford et al.
patent: 5376810 (1994-12-01), Hoenk et al.
patent: 5380474 (1995-01-01), Rye et al.
patent: 5417802 (1995-05-01), Obeng
patent: 5421981 (1995-06-01), Leader et al.
patent: 5422295 (1995-06-01), Choi et al.
patent: 5424549 (1995-06-01), Feldman
patent: 5425848 (1995-06-01), Haisma et al.
patent: 5431777 (1995-07-01), Austin et al.
patent: 5439766 (1995-08-01), Day et al.
patent: 5453157 (1995-09-01), Jeng
patent: 5458520 (1995-10-01), DeMercurio et al.
patent: 5468542 (1995-11-01), Crouch
patent: 5527662 (1996-06-01), Hashimoto et al.
patent: 5601641 (1997-02-01), Stephens
patent: 5654238 (1997-08-01), Cronin et al.
patent: 5670415 (1997-09-01), Rust
patent: 5700626 (1997-12-01), Lee et al.
patent: 5723176 (1998-03-01), Keyworth et al.
patent: 5736424 (1998-04-01), Prybyla et al.
patent: 5743998 (1998-04-01), Park
patent: 5772905 (1998-06-01), Chou
patent: 5849209 (1998-12-01), Kindt-Larsen et al.
patent: 5849222 (1998-12-01), Jen et al.
patent: 5855686 (1999-01-01), Rust
patent: 5895263 (1999-04-01), Carter et al.
patent: 5907782 (1999-05-01), Wu
patent: 5926690 (1999-07-01), Toprac et al.
patent: 5948219 (1999-09-01), Rohner
patent: 5948570 (1999-09-01), Kornblit et al.
patent: 6033977 (2000-03-01), Gutsche et al.
patent: 6035805 (2000-03-01), Rust
patent: 6096655 (2000-08-01), Lee et al.
patent: 6150231 (2000-11-01), Muller et al.
patent: 6150680 (2000-11-01), Eastman et al.
patent: 6245581 (2001-06-01), Bonser et al.
patent: 6274294 (2001-08-01), Hines
patent: 6309580 (2001-10-01), Chou
patent: 6326627 (2001-12-01), Putvinski et al.
patent: 6329256 (2001-12-01), Ibok
patent: 6334960 (2002-01-01), Willson et al.
patent: 6383928 (2002-05-01), Eissa
patent: 6387783 (2002-05-01), Furukawa et al.
patent: 6388253 (2002-05-01), Su
patent: 6391217 (2002-05-01), Schaffer et al.
patent: 6391798 (2002-05-01), DeFelice et al.
patent: 6455411 (2002-09-01), Jiang et al.
patent: 6482742 (2002-11-01), Chou
patent: 6489068 (2002-12-01), Kye
patent: 6514672 (2003-02-01), Young et al.
patent: 6517977 (2003-02-01), Resnick et al.
patent: 6517995 (2003-02-01), Jacobson et al.
patent: 6518189 (2003-02-01), Chou
patent: 6534418 (2003-03-01), Plat et al.
patent: 6541360 (2003-04-01), Plat et al.
patent: 6561706 (2003-05-01), Singh et al.
patent: 6565928 (2003-05-01), Sakamoto et al.
patent: 6580172 (2003-06-01), Mancini et al.
patent: 6632742 (2003-10-01), Yang et al.
patent: 6635581 (2003-10-01), Wong
patent: 6646662 (2003-11-01), Nebashi et al.
patent: 6677252 (2004-01-01), Marsh
patent: 6696220 (2004-02-01), Bailey et al.
patent: 6703190 (2004-03-01), Elian et al.
patent: 6713238 (2004-03-01), Chou et al.
patent: 6716767 (2004-04-01), Shih et al.
patent: 6730256 (2004-05-01), Bloomstein et al.
patent: 6737202 (2004-05-01), Gehoski et al.
patent: 6743713 (2004-06-01), Mukherjee-Roy et al.
patent: 6767983 (2004-07-01), Fujiyama et al.
patent: 6770852 (2004-08-01), Steger
patent: 6776094 (2004-08-01), Whitesides et al.
patent: 6777170 (2004-08-01), Bloomstein et al.
patent: 6809356 (2004-10-01), Chou
patent: 6828244 (2004-12-01), Chou
patent: 2002/0042027 (2002-04-01), Chou et al.
patent: 2002/0132482 (2002-09-01), Chou
patent: 2002/0167117 (2002-11-01), Chou
patent: 2002/0177319 (2002-11-01), Chou
patent: 2003/0011368 (2003-01-01), Mancini et al.
patent: 2003/0034329 (2003-02-01), Chou
patent: 2003/0080471 (2003-05-01), Chou
patent: 2003/0080472 (2003-05-01), Chou
patent: 2003/0081193 (2003-05-01), White et al.
patent: 2003/0129542 (2003-07-01), Shih et al.
patent: 2004/0029041 (2004-02-01), Shih et al.
patent: 2004/0036201 (2004-02-01), Chou et al.
patent: 2004/0046288 (2004-03-01), Chou
patent: 2004/0110856 (2004-06-01), Young et al.
patent: 2004/0118809 (2004-06-01), Chou et al.
patent: 2004/0131718 (2004-07-01), Chou et al.
patent: 2004/0137734 (2004-07-01), Chou et al.
patent: 2004/0156108 (2004-08-01), Chou et al.
patent: 2004/0197843 (2004-10-01), Chou et al.
patent: 2004/0200411 (2004-10-01), Willson et al.
patent: 55-88332 (1978-12-01), None
patent: 57-7931 (1980-06-01), None
patent: 63-138730 (1986-12-01), None
patent: 02-24848 (1990-01-01), None
patent: 02-92603 (1990-04-01), None
patent: WO 99/05724 (1999-02-01), None
patent: WO 00/21689 (2000-04-01), None
patent: WO 01/47003 (2001-06-01), None
patent: WO 02/07199 (2002-01-01), None
patent: WO 03/010289 (2003-02-01), None
patent: WO 03/079416 (2003-09-01), None
patent: WO 03/099536 (2003-12-01), None
patent: WO 2004/013693 (2004-02-01), None
patent: WO 2004/016406 (2004-02-01), None
patent: WO 2004/114016 (2004-12-01), None
Abstract of Japanese Patent 63-138730.
Abstract of Japanese Patent 55-88332.
Abstract of Japanese Patent 57-7931.
Abstract of Japanese Patent 02-92603.
Translation of Japanese Patent 02-92603.
Abstract of Japanese Patent 02-24848.
Translation of Japanese Patent 02-24848.
Heidari et al., “Nanoimprint Lithography at the 6 in. Wafer Scale,” Journal of Vacuum Science Technology, Nov/Dec 2000, pp. 3557-3560, vol. B, No. 18(6)/.
Nerac.com Retro Search, “Reduction of Dimension of Contact Holes”, Au
Bonnecaze Roger T.
Sreenivasan Sidlgata V.
Willson Carlton Grant
Brooks Kenneth C.
Molecular Imprints, Inc.
Norton Nadine G.
Tran Binh X.
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