Semiconductor device manufacturing: process – Introduction of conductivity modifying dopant into... – Ion implantation of dopant into semiconductor region
Reexamination Certificate
2004-12-30
2010-11-02
Nguyen, Khiem D (Department: 2823)
Semiconductor device manufacturing: process
Introduction of conductivity modifying dopant into...
Ion implantation of dopant into semiconductor region
C257SE21057, C257SE21473, C250S492200, C250S492210, C250S492230
Reexamination Certificate
active
07825015
ABSTRACT:
The present invention provides a method for implanting ions in a semiconductor device capable of compensating for a difference in threshold voltages between a central portion and edge portions of a substrate generated while performing uniform ion implantation to entire surfaces of a substrate and another method for fabricating a semiconductor device capable of improving distribution of transistor parameters inside a substrate by forming a nonuniform channel doping layer or by forming a nonuniform junction profile.
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Jin Seung-Woo
Lee Min-Yong
Rouh Kyoung-Bong
Sohn Yong-Sun
Hynix / Semiconductor Inc.
Nguyen Khiem D
Townsend and Townsend / and Crew LLP
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