Method for imaging printed circuit board component leads

Details Method for imaging printed circuit board component leads Method for imaging printed circuit board component leads

1986-03-19

1988-03-01

Eley, Timothy V.

Optics: measuring and testing

By configuration comparison

With comparison to master, desired shape, or reference voltage

356237, 356398, G01B 1100

Patent

active

047281952

ABSTRACT:
The invention provides a novel system for imaging a component lead on an assembled printed circuit board. The system incorporates a light source for illuminating a substantial portion of a solder pad of the circuit board being inspected. A photoreceptor receives emissions reflected from the illuminated portion of said solder pad and generates an image representative thereof. This photoreceptor is arranged so that passage of a component lead through the component hole occludes or shadows a portion of the solder pad from which the photoreceptor would otherwise receive reflected emissions. The system has application in the testing of printed circuit boards prior to wave soldering.

REFERENCES:
patent: 4240750 (1980-12-01), Kurtz et al.

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