Method for high performance inductor fabrication using a...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material

Reexamination Certificate

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C438S381000, C438S622000, C438S631000, C257SE21022

Reexamination Certificate

active

07399696

ABSTRACT:
A method of forming a high performance inductor comprises providing a substrate; forming a plurality of wiring levels over the substrate, wherein each of the wiring levels comprise a dielectric layer; forming a first trench having a first depth in a first dielectric layer on a first wiring level; forming a second trench in the first dielectric layer having a second depth extending at least into a second wiring level; forming a conductor layer substantially simultaneously in the first and second trenches; and removing portions of the conductor layer overfilling the first and second trenches to form a spiral-shaped inductor in the second trench. The method may further comprise forming an interconnect structure in the first trench.

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J. N. Burghartz, et al., “Monolithic Spiral Inductors Fabricated Using a VLSI Cu-Damascene Interconnect Technology and Low-Loss Substrates”, IEDM 1996, Dec. 8-11, 1996, pp. 99-102.

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