Method for high aspect ratio pattern transfer

Details Method for high aspect ratio pattern transfer Method for high aspect ratio pattern transfer

2006-06-20

2006-06-20

Chu, John S. (Department: 1752)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Forming nonplanar surface

C430S192000, C430S281100, C430S326000, C430S327000, C430S330000

Reexamination Certificate

active

07063939

ABSTRACT:
The present invention relates a method for high aspect ratio pattern transfer, by using combination of imprint and Step and Flash techniques to transfer high aspect ratio pattern. The present invention simultaneously saves the developing time and the amount of developer used during the photo-resist pattern transfer process. The present invention is able to avoid separation and dissolution between pattern and substrate that is attacked by developer, and is able to yield high aspect ratio patterns.

REFERENCES:
patent: 5772905 (1998-06-01), Chou
patent: 2003/0205657 (2003-11-01), Voisin
patent: 2003/0205658 (2003-11-01), Voisin
patent: 2004/0008334 (2004-01-01), Sreenivasan et al.
patent: 2004/0141163 (2004-07-01), Bailey et al.
patent: 2005/0123674 (2005-06-01), Stasiak et al.
T.C. Bailey et al.; “Step and Flash Imprint Lithography: An Efficient Nanocale Printing Technology”;J. Photopolymer Science Technology; 6 pages; 2002.

Affiliated with

Also associated with

Rating

Method for high aspect ratio pattern transfer does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for high aspect ratio pattern transfer, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for high aspect ratio pattern transfer will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3630625