Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – By reaction with substrate
Reexamination Certificate
2007-09-30
2010-02-09
Sarkar, Asok K (Department: 2891)
Semiconductor device manufacturing: process
Coating of substrate containing semiconductor region or of...
By reaction with substrate
C257SE21267, C257SE21268, C257SE21285, C438S769000, C438S770000, C438S773000, C438S786000
Reexamination Certificate
active
07659214
ABSTRACT:
A method for growing an oxynitride film on a substrate includes positioning the substrate in a process chamber, heating the process chamber, flowing a first wet process gas comprising water vapor into the process chamber, and reacting the substrate with the first wet process gas to grow an oxide film on the substrate. The method further includes flowing a second wet process gas comprising water vapor and a nitriding gas comprising nitric oxide into the process chamber, and reacting the oxide film and the substrate with the second wet process gas to grow an oxynitride film. In another embodiment, the method further comprises annealing the substrate containing the oxynitride film in an annealing gas. According to one embodiment of the method where the substrate is silicon, a silicon oxynitride film can be formed that exhibits a nitrogen peak concentration of approximately 3 atomic % or greater.
REFERENCES:
patent: 5674788 (1997-10-01), Wristers et al.
patent: 5808398 (1998-09-01), Stoffels et al.
patent: 5939763 (1999-08-01), Hao et al.
patent: 5998270 (1999-12-01), Gilmer et al.
patent: 6001694 (1999-12-01), Shih et al.
patent: 6248628 (2001-06-01), Halliyal et al.
patent: 6436848 (2002-08-01), Ramkumar
patent: 6450116 (2002-09-01), Noble et al.
patent: 6649537 (2003-11-01), Reder et al.
patent: 6683010 (2004-01-01), Lim et al.
patent: 6692249 (2004-02-01), Beatty et al.
patent: 6869892 (2005-03-01), Suzuki et al.
patent: 6887797 (2005-05-01), Buchanan et al.
patent: 6929699 (2005-08-01), Whitesell
patent: 6939756 (2005-09-01), Chung et al.
patent: 2006/0148179 (2006-07-01), Wang et al.
Babu, Naseer et al., Tunnel Oxide Growth on Silicon with “Wet Nitrous Oxide” Process for Improved Performance Characteristics, IEEE Electron Device Letters, vol. 27, Nov. 2006, pp. 881-883.
Tada, Y. et al., High Quality Ultra-thin Gate Oxynitride Formation by Fast Ramp Verticle Furnace, 1999 RTP Conference, 8pp.
U.S. Patent and Trademark Office, Non-final Office Action received in related U.S. Appl. No. 10/694,643 dated Mar. 18, 2008, 19pp.
U.S. Patent and Trademark Office, Final Office Action received in related U.S. Appl. No. 10/694,643 dated Nov. 3, 2008, 14pp.
Ellis, K.A. et al., Nitrous Oxide (N2O) Processing for Silicon Oxynitride Gate Dielectrics, IBM J. Res. Develop. vol. 43, No. 3, May 1999, pp. 287-300.
Dang, Sanjit Singh et al., Nitrous Oxide-Based Progressive Silicon Oxynitridation in Furnaces of Different Dimensions, Advanced Materials Research Laboratory, Department of Chemical Engineering, University of Illinois at Chicago, Chicago, IL 60607, Undated, 5 pages.
Dip Anthony
Reid Kimberly G.
Sarkar Asok K
Tokyo Electron Limited
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