Method for galvanic forming of bonding pads

Details Method for galvanic forming of bonding pads Method for galvanic forming of bonding pads

1996-04-22

1999-11-23

Graybill, David

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438678, 438615, 438653, 438654, 438686, 438687, 438688, H01L 21288, H01L 2160

Patent

active

059899930

ABSTRACT:
Method for the preparation of electrodeposited or galvanically deposited bumps for the bonding of integrated circuits, characterized by two subsequent metal depositions, deposited without an external current source (chemical metal deposition) on a metallization 1, the first deposition being thicker than the second and the second deposition being more even or more regular throughout a large area than the first one.

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