4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor

Elke Zakel

Assignee

Rate now
  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Assignee

active

No affiliations

Chip-contacting method requiring no contact bumps, and electroni

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Patent

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Method for galvanic forming of bonding pads

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Patent

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Method for producing a contactless chip card

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Method for producing contactless chip cards and...

Registers – Records
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Elke Zakel does not yet have a rating. At this time, there are no reviews or comments for this inventor.

If you have personal experience with Elke Zakel, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Elke Zakel will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-P-809269

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.

Canada

 Charities
 Companies
 MP Candidates
 Patents
 Employee Salary Disclosure

World

 Places of the World
 Scientific Papers

United States

 Banks
 Companies
 Counties
 Patents
 Employee Salary Disclosure