Metal fusion bonding – Process – Plural joints
Reexamination Certificate
2006-04-25
2009-11-03
Ward, Jessica L. (Department: 1793)
Metal fusion bonding
Process
Plural joints
C438S613000
Reexamination Certificate
active
07611040
ABSTRACT:
A method for forming solder bumps for realizing high density mounting and a highly reliable method for mounting a semiconductor device is provided. A flat plate having a plurality of projections or recesses thereon is prepared; the flat plate is aligned to oppose an electronic component and a resin composition including a solder powder is supplied to a gap between the flat plate and the electronic component; the resin composition is annealed to melt the solder powder included in the resin composition for growing the solder powder up to the level of the surface of the flat plate by allowing the melted solder powder to self-assemble on terminals, so as to form solder bumps on the terminals; and the flat plate is removed after cooling and solidifying the solder bumps. Thus, the solder bumps having pits corresponding to the projections or having protrusions corresponding to the recesses are formed.
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Kitae Takashi
Kojima Toshiyuki
Komatsu Shingo
Nakatani Seiichi
Yamashita Yoshihisa
Gamino Carlos
McDermott Will & Emery LLP
Panasonic Corporation
Ward Jessica L.
LandOfFree
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