Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – By reaction with substrate
Patent
1997-05-23
2000-10-31
Bowers, Charles
Semiconductor device manufacturing: process
Coating of substrate containing semiconductor region or of...
By reaction with substrate
438771, 427579, H05N 102
Patent
active
061402508
ABSTRACT:
In an oxide film forming apparatus for a semiconductor device preprocessing time to measure concentration can be greatly shortened, and the oxide film can be formed with supreme reproducibility in stable manufacturing stages. The oxide film forming apparatus is arranged by comprising: a high voltage source for generating a DC high voltage having a negative polarity; one pair of electrodes arranged apart from each other via a space portion, the DC high voltage being applied to one electrode of the one-paired electrodes; a flow path channel formed from an upstream located in a direction perpendicular to the electrodes via the space portion to a downstream, through which oxygen gas may flow; an oxygen source for supplying the oxygen gas from the upstream side of the flow path channel; and a substrate base arranged on the downstream side of the flow path channel, by which a semiconductor substrate can be mounted at a position where this semiconductor substrate is exposed by the oxygen gas which has passed between the one pair of electrodes.
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Bowers Charles
Kilday Lisa
Sony Corporation
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