Etching a substrate: processes – Gas phase etching of substrate – Application of energy to the gaseous etchant or to the...
Reexamination Certificate
2007-04-05
2011-12-27
Norton, Nadine G (Department: 1713)
Etching a substrate: processes
Gas phase etching of substrate
Application of energy to the gaseous etchant or to the...
C216S017000, C216S022000, C216S037000, C216S041000, C216S095000, C216S099000, C438S003000
Reexamination Certificate
active
08083962
ABSTRACT:
A method for forming a minute pattern includes depositing a material layer on a semiconductor substrate having a conductive region, forming a first mask layer on the material layer, forming a recess region in the first mask layer, performing layer processing to form a first mask pattern in the recess region, and etching the material layer to form a material layer pattern.
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Jeong Jun-Ho
Lee Jang-Eun
Nam Kyung-Tae
Oh Se-Chung
Lee & Morse P.C.
Norton Nadine G
Remavege Christopher
Samsung Electronics Co,. Ltd.
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