Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – By reaction with substrate
Reexamination Certificate
2011-06-14
2011-06-14
Richards, N Drew (Department: 2895)
Semiconductor device manufacturing: process
Coating of substrate containing semiconductor region or of...
By reaction with substrate
C438S769000, C438S775000, C438S778000, C438S785000, C438S792000, C257SE21268
Reexamination Certificate
active
07960293
ABSTRACT:
A method for forming an insulating film includes forming a silicon nitride film on a silicon surface by subjecting a target substrate wherein silicon is exposed in the surface to a treatment for nitriding the silicon, forming a silicon oxynitride film by heating the target substrate provided with the silicon nitride film in an N2O atmosphere, and nitriding the silicon oxynitride film.
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Honda Minoru
Nakanishi Toshio
Sato Yoshihiro
Lee Kyoung
Oblon, Spivak McClelland, Maier & Neustadt, L.L.P.
Richards N Drew
Tokyo Electron Limited
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