Method for forming capacitor of semiconductor device

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C438S003000, C438S396000

Reexamination Certificate

active

06893913

ABSTRACT:
Disclosed is a method for forming a capacitor of a semiconductor device. The forming method comprises the step of forming an interlayer insulating film on a semiconductor substrate formed with a bit line. A contact plug to be in contact with the substrate is formed within the interlayer insulating film. A storage electrode is formed on the interlayer insulating film in such a manner that the storage electrode comes in contact with the contact plug. A dielectric film composed of a single composite film of Ta2O5(X)Y2O3(1−X) is also formed on the storage electrode according to ALD (Atomic Layer Deposition) technology. A diffusion barrier film is deposited on the dielectric film, and a plate electrode is formed on the diffusion barrier film. The present invention can provide a capacitor having sufficient capacitance necessary for a stable device operation by applying the Ta2O5(X)Y2O3(1−X) single composite film to the dielectric film.

REFERENCES:
patent: 6014310 (2000-01-01), Bronner et al.
patent: 6198124 (2001-03-01), Sandu et al.
patent: 6207561 (2001-03-01), Hwang et al.
patent: 6423593 (2002-07-01), Yamamoto et al.
patent: 6461911 (2002-10-01), Ahn et al.
patent: 20030031793 (2003-02-01), Chang et al.
patent: 2000 68160 (2000-03-01), None
patent: 2000 353787 (2000-11-01), None

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