Semiconductor device manufacturing: process – Making passive device – Stacked capacitor
Reexamination Certificate
2006-06-06
2006-06-06
Smith, Bradley K. (Department: 2891)
Semiconductor device manufacturing: process
Making passive device
Stacked capacitor
C438S253000, C438S693000, C257S534000
Reexamination Certificate
active
07056803
ABSTRACT:
Disclosed is a method for forming a capacitor of a semiconductor device. The method comprises the steps of: forming a nitride film for storage electrode on a semiconductor substrate; forming an oxide film for storage electrode on the nitride film; selectively etching the oxide film and the nitride film to define a storage electrode region; forming a conductive layer for storage electrode on the semiconductor substrate including the storage electrode region; forming a gap-filling nitride film on the semiconductor substrate to fill up the storage electrode region; performing a CMP process using the oxide film as a polishing stop layer to form a storage electrode; and removing the gap-filling nitride film.
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Jung Jong Goo
Park Hyung Soon
Fulk Steven J
Heller Ehrman LLP
Hynix / Semiconductor Inc.
Smith Bradley K.
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