Method for forming bumps

Details Method for forming bumps Method for forming bumps

2006-10-17

2009-06-02

Zarneke, David A (Department: 2891)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C257SE21508

Reexamination Certificate

active

07541273

ABSTRACT:
A method for forming bumps is disclosed. First, a substrate having a surface and an under bump metallurgy layer formed thereon is provided, and a portion of the under bump metallurgy layer is removed thereafter. Next, a mask having a metal layer thereon is disposed over the surface of substrate, in which the mask includes at least one opening for exposing the under bump metallurgy layer. Subsequently, a metal is disposed in the opening and the mask having the metal layer is removed.

REFERENCES:
patent: 5462638 (1995-10-01), Datta et al.
patent: 6767818 (2004-07-01), Chang et al.
patent: 2004/0259345 (2004-12-01), Yu et al.

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