Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
Reexamination Certificate
2005-10-11
2005-10-11
Nhu, David (Department: 2818)
Semiconductor device manufacturing: process
Making field effect device having pair of active regions...
Having insulated gate
C438S386000, C438S474000
Reexamination Certificate
active
06953723
ABSTRACT:
Disclosed is a method for forming a bottle shaped trench. The method of the present invention includes steps of providing a substrate; forming a plurality of operation layers on the substrate; forming a photoresist layer on the operation layers to define a predetermined position; forming a trench according to the predetermined position; implanting predetermined ions, which reduces oxidizing rate of the sidewall of the trench, into the upper sidewall of the trench; oxidizing the sidewall of the trench to form an oxide layer, in which the portion of the oxide layer formed at the portion of the sidewall implanted with the ions is thin, while the portion of the oxide layer formed at the portion of the sidewall not implanted with the ions is thick; and removing the oxide layer to form a bottle shaped trench.
REFERENCES:
patent: 5837612 (1998-11-01), Ajuria et al.
patent: 6018174 (2000-01-01), Schrems et al.
patent: 6071823 (2000-06-01), Hung et al.
patent: 6194755 (2001-02-01), Gambino et al.
patent: 6232171 (2001-05-01), Mei
patent: 6426254 (2002-07-01), Kudelka et al.
patent: 6716757 (2004-04-01), Lin et al.
Chen Yi-Nan
Chou Shih-Chung
Bacon & Thomas PLLC
NANYA Technology Corporation
Nhu David
LandOfFree
Method for forming bottle shaped trench does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for forming bottle shaped trench, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for forming bottle shaped trench will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3472973