Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering
Patent
1995-08-07
1998-02-03
Nguyen, Nam
Chemistry: electrical and wave energy
Processes and products
Coating, forming or etching by sputtering
20419215, 2041922, C23C 1434
Patent
active
057140448
ABSTRACT:
A method for forming an overcoat having first and second layers in a magnetic recording medium is described. The first overcoat layer is deposited in a first sputtering chamber where the magnetic means for confining target plasma in the chamber are oriented to retain magnetic-field confinement about the target surface and to produce magnetic field lines between directly confronting portions of the confronting sputtering targets. The second overcoat layer is deposited under a nitrogen-containing atmosphere.
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U.S. application No. 08/615,728, Lal et al., filed Mar. 14, 1996.
Bourez Allen J.
Lal Brij Bihari
Russak Michael A.
Dehlinger Peter J.
HMT Technology Corporation
Mohr Judy M.
Nguyen Nam
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