Method for forming a split gate device

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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Details

C438S267000, C438S593000, C438S689000, C438S706000, C438S734000, C257SE21209, C257SE21645, C257SE21681

Reexamination Certificate

active

08048738

ABSTRACT:
A method for forming a semiconductor device includes forming a dielectric layer over a substrate. The method further includes forming a select gate layer over the dielectric layer. The method further includes etching the select gate layer at a first etch rate to form a first portion of a sidewall of a select gate, wherein the step of etching the select gate layer at the first etch rate includes using an oxidizing agent to oxidize at least a top portion of the substrate underlying the dielectric layer to form an oxide layer. The method further includes etching the select gate layer at a second etch rate lower than the first etch rate to form a second portion of the sidewall of the select gate, wherein the step of etching the select gate layer at the second etch rate includes removing only a top portion of the dielectric layer.

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