Method for forming a self-aligned twin well region with...

Semiconductor device manufacturing: process – Forming bipolar transistor by formation or alteration of... – Self-aligned

Reexamination Certificate

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C438S322000, C438S327000, C438S370000, C438S373000, C438S375000, C257SE21461, C257SE21476, C257SE21612, C257SE29345, C257SE33005, C257SE33012, C257SE33019, C257SE33063

Reexamination Certificate

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07541250

ABSTRACT:
A method for forming a self-aligned twin well region is provided. The method includes implanting a first well type doping species into the DHL such that its distribution remains stopped in the DHL above the silicon substrate, etching away a portion of the DHL using a photoresist mask, implanting a second well type doping species into the portions of the silicon substrate exposed by the etching, and moving a portion of the first well type doping species into the silicon substrate.

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Karl Wimmer, Dissertation: Two-Dimensional Nonplanar Process Simulation (Chapter 2.5.2 Knock-in Implantation—A Feasibility Study for the Production of Ultra Shallow Profiles), Oct. 19, 1994.

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