Method for forming a pattern using a photosensitive composition

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Forming nonplanar surface

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430165, 430190, 430192, 430193, G03F 730, G03F 7023

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active

054478251

ABSTRACT:
A photosensitive resin composition comprising an alkali-soluble resin, a quinonediazide-type photosensitive compound and a solvent, as the main components, wherein the alkali-soluble resin is a polycondensation product of 1 at least one phenolic compound of the following formula (A) and 2 (a) formaldehyde and (b) at least one ketone or aldehyde of the following formula (B), and the mixing ratio of the formaldehyde (a) to the ketone or aldehyde (b) is within a range of from 1/99 to 99/1 in terms of the molar ratio of (a)/(b): ##STR1## wherein R.sup.1 is a group of the formula R.sup.2,OR.sup.3,COOR.sup.4 or CH.sub.2 COOR.sup.5,wherein R.sup.2 is a C.sub.1-4 alkyl group, each of R.sup.3,R.sup.4 and R.sup.5 which are independent of one another, is a hydrogen atom or a C.sub.1-4 alkyl group, n is an integer of from 0 to 3, provided that when n is 2 or 3, a plurality of R.sup.1 may be the same or different, and each of R.sup.6 and R.sup.7 which are independent of each other, is a hydrogen atom, a C.sub.1-4 lower alkyl group, an aryl group or an aralkyl group, provided that R.sup.6 and R.sup.7 are not simultaneously hydrogen atoms.

REFERENCES:
patent: 4536465 (1985-08-01), Uehara et al.
patent: 4943511 (1990-07-01), Lazarus et al.
patent: 5087548 (1992-02-01), Hosaka et al.
patent: 5279918 (1994-01-01), Nishi et al.

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