Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2008-05-20
2008-05-20
Sarkar, Asok Kumar (Department: 2891)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C257SE21439
Reexamination Certificate
active
07375025
ABSTRACT:
On first and second regions of a substrate are formed a first gate structure including a first gate electrode and a first spacer, and a second gate structure including a second gate electrode and a second spacer, respectively. The first and second spacers are removed to different depths such that side portions of the first and second gate electrodes have different exposed thicknesses. A metal silicide layer is formed on the first and second regions including the first and second gate structures. The metal silicide layer formed on the second gate electrode has a second thickness that is greater than a first thickness of the metal silicide layer formed on the first gate electrode. The spacers in the gate structures of resulting N type and P type MOS transistors are removed to different thicknesses, thereby minimizing deformation in the gate structures and also improving electrical characteristics and thermal stability of the gate electrodes.
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Lee Eung-Joon
Park In-sun
Roh Kwan-Jong
Mills & Onello LLP
Samsung Electronics Co,. Ltd.
Sarkar Asok Kumar
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