Method for forming a DRAM capacitor

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

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438398, H01L 218242

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active

06074913&

ABSTRACT:
A method for manufacturing a metal-insulator-metal capacitor on a substrate is disclosed. The method comprises the steps of: forming a first dielectric layer onto said substrate; patterning and etching said first dielectric layer to form a contact opening; forming a first metal layer onto said first dielectric layer and into said contact opening; forming a barrier layer onto said first metal layer; forming a second dielectric layer onto said barrier layer; forming a discrete HSG layer onto said second dielectric layer; etching said second dielectric layer by using said HSG layer as a mask; stripping said HSG layer; etching said barrier layer and said first metal layer by using a remaining portion of said second dielectric layer as a mask; stripping said remaining portion of said second dielectric layer; patterning and etching a remaining portion of said barrier layer and a remaining portion of said first metal layer; forming a third dielectric layer over said barrier layer, said first metal layer and said first dielectric layer; and forming a second metal layer over said third dielectric layer.

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