Method for fine pattern formation on a photoresist

Details Method for fine pattern formation on a photoresist Method for fine pattern formation on a photoresist

1984-11-19

1986-05-13

Bowers, Jr., Charles L.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Forming nonplanar surface

430197, 430296, 430330, 430967, G03F 726

Patent

active

045886750

ABSTRACT:
A method for high fidelity patterning of a photoresist layer involving a dry-process development by exposure to a plasma gas. A photoresist layer which had been irradiated in a pattern with actinic rays is heated at a temperature in the range from 200.degree. to 500.degree. C. by applying heat to the surface of the substrate opposite to the surface bearing the photoresist layer, for example, by placing the substrate on a hot plate with the uncoated surface in contact with the hot plate. Subsequent exposure to plasma gas gives a patterned resist layer with a very high residual film thickness.

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Walker, E. J., IEEE Transactions on Electron Devices, vol. ED-22, No. 7, 7/1975.

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