Method for fabrication of a non-symmetrical transistor

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

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438305, 438595, H01L 218234

Patent

active

056565186

ABSTRACT:
In the present invention, a method for fabrication of a non-symmetrical LDD-IGFET is described. The present invention includes a gate insulator and a gate electrode, such as a polysilicon, formed over a semiconductor substrate, the gate electrode having a top surface and opposing first and second sidewalls. A first dopant is implanted to provide a lightly doped drain region substantially aligned with the second sidewall. An oxide layer provides first and second sidewall oxide regions adjacent the first and second sidewalls, respectively. The first sidewall oxide region is isolated using a nitride layer having a window which exposes the second sidewall oxide region. Thermal oxidation is applied to the second sidewall oxide region wherein the size of the second sidewall oxide region increases while the size of the first sidewall oxide region remains substantially constant. The first sidewall oxide region is then exposed by removing the nitride layer and a second dopant is implanted to provide a heavily doped drain region substantially aligned with the outside edge of the second sidewall oxide region and a heavily doped source region.

REFERENCES:
patent: 5286664 (1994-02-01), Horiuchi
patent: 5424229 (1995-06-01), Oyamatsu
patent: 5547885 (1996-08-01), Ogoh

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