Method for fabricating transistor of semiconductor device

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C438S305000, C438S206000, C438S558000, C438S520000, C438S525000, C438S585000, C438S595000, C257SE21135, C257SE21136, C257SE21137, C257SE21138, C257SE21139, C257SE21140, C257SE21141, C257SE21142, C257SE21143, C257SE21144, C257SE21145, C257SE21146, C257SE21147, C257SE21148, C257SE21149, C257SE21150, C257SE21151, C257SE21152, C257SE21153

Reexamination Certificate

active

10874932

ABSTRACT:
Disclosed is a method for fabricating a transistor of a semiconductor device, the method comprising the steps of: providing a semiconductor; forming a gate electrode; performing a low-density ion implantation process with respect to the substrate, thereby forming an LDD ion implantation layer; forming an insulation spacer on a sidewall of the gate electrode; forming a diffusion barrier; performing a high-density ion implantation process with respect to the substrate, thereby forming a source/drain; performing a first thermal treatment process with respect to a resultant structure, so as to activate impurities in the source/drain, and simultaneously causing a diffusion velocity of the impurities in the source/drain to be reduced by the diffusion barrier; and forming a salicide layer.

REFERENCES:
patent: 6030874 (2000-02-01), Grider et al.
patent: 6358807 (2002-03-01), Chyan et al.
patent: 6437406 (2002-08-01), Lee
patent: 6514833 (2003-02-01), Ishida et al.
patent: 6803636 (2004-10-01), Ibara et al.
patent: 2005/0109608 (2005-05-01), Su
patent: 2001-0087474 (2001-09-01), None

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