Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2008-04-29
2008-04-29
Pham, Hoai v (Department: 2814)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S112000, C438S122000, C257SE21503
Reexamination Certificate
active
07364944
ABSTRACT:
A thermally enhanced semiconductor package and a fabrication method thereof are provided. A plurality of conductive bumps are formed on bond pads on an active surface of a chip. A heat sink is attached to an inactive surface of the chip and has a surface area larger than that of the chip. An encapsulation body encapsulates the heat sink, chip and conductive bumps, while exposing a bottom or surfaces, not for attaching the chip, of the heat sink and ends of the conductive bumps outside. A plurality of conductive traces are formed on the encapsulation body and electrically connected to the ends of the conductive bumps. A solder mask layer is applied over the conductive traces and formed with a plurality of openings for exposing predetermined portions of the conductive traces. A solder ball is implanted on each exposed portion of the conductive traces.
REFERENCES:
patent: 5825087 (1998-10-01), Iruvanti et al.
patent: 6271469 (2001-08-01), Ma et al.
patent: 6287893 (2001-09-01), Elenius et al.
patent: 6507104 (2003-01-01), Ho et al.
patent: 6603198 (2003-08-01), Akram et al.
patent: 6661103 (2003-12-01), Akram
patent: 6998292 (2006-02-01), McDonough et al.
Hsiao Cheng-Hsu
Huang Chien-Ping
Corless Peter F.
Edwards Angell Palmer & & Dodge LLP
Jensen Steven M.
Pham Hoai v
Siliconware Precision Industries Co., LTD.
LandOfFree
Method for fabricating thermally enhanced semiconductor package does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for fabricating thermally enhanced semiconductor package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for fabricating thermally enhanced semiconductor package will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2774590