Method for fabricating superconducting weak-links using electron

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Electron beam imaging

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430313, 430315, 430319, 430330, G03C 500

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045268584

ABSTRACT:
A method for fabricating indium variable thickness super conducting microbridges uses a single layer of electron resist and EBL to draw a mask which has a gap with a small amount of undercut. A thin layer of material is deposited at normal incidence to form the bridge and material deposited at a sufficiently large oblique angle forms the banks separately. Typical VTB's have bridges 1000 .ANG. thick and <0.4 .mu.m long with the banks 7 .mu.m thick and R.sub.n.sup..about. 0.1.OMEGA.. The method can also form other non-hysteretic weak links such as the SNS junction.

REFERENCES:
Berker et al., "Dual-Polarity, Single-Resist Mixed (E-Beam/Photo) Lithogry", IEEE Electron Device Letters, vol. 2, EDL-2, No. 11, Nov. 1981, pp. 281-283.
G. J. Dolan, "Offset Masks for Lift-Off Photoprocessing", Applied Physics Letters, vol. 31, No. 5, Sep. 1, 1977, p. 337.
Sato et al., "Submicron Electron-Beam Patterning of Aluminum by a Double-Layer Pattern Transfer Technique", J. Vac. Sci. Technol., 19(4), (Nov./Dec. 1981) pp. 1329-1332.

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