Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate
2005-12-06
2008-08-12
Le, Thao X. (Department: 2892)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
C257SE21499
Reexamination Certificate
active
07410835
ABSTRACT:
A short-prevented lead frame and a method for fabricating a semiconductor package with the lead frame are proposed, wherein each lead of the lead frame is formed with a thickness-reduced portion at a peripheral position of the lead frame, allowing thickness-reduced portions of adjacent leads to be arranged in a stagger manner. This stagger arrangement significantly increases pitches between the neighboring thickness-reduced portions of leads. Therefore, during a singulation process as to cut through the leads, lead bridging and short-circuiting between adjacent leads caused by cut-side burrs can be prevented from occurrence, whereby singulation quality and product yield and reliability are effectively improved.
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Hsu Chin-Teng
Hung Jui-Hsiang
Yang Chen-Hsiung
Yang Chih-Jen
Corless Peter F.
Edwards Angell Palmer & & Dodge LLP
Jensen Steven M.
Le Thao X.
Siliconware Precision Industries Co. Ltd.
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