Method for fabricating semiconductor device with an...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – Insulated gate formation

Reexamination Certificate

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C438S597000, C438S642000, C257SE21495, C257SE29129

Reexamination Certificate

active

08008178

ABSTRACT:
A method for fabricating a semiconductor device includes forming a first conductive layer over a substrate, forming an intermediate structure over the first conductive layer, the intermediate structure formed in a stack structure comprising at least a first metal layer and a nitrogen containing metal silicide layer, and forming a second conductive layer over the intermediate structure.

REFERENCES:
patent: 5518958 (1996-05-01), Giewont et al.
patent: 5719410 (1998-02-01), Suehiro et al.
patent: 5796151 (1998-08-01), Hsu et al.
patent: 5796166 (1998-08-01), Agnello et al.
patent: 5925918 (1999-07-01), Wu et al.
patent: 5942356 (1999-08-01), Mitsui et al.
patent: 5998290 (1999-12-01), Wu et al.
patent: 6075274 (2000-06-01), Wu et al.
patent: 6107171 (2000-08-01), Tsai
patent: 6208003 (2001-03-01), Miura
patent: 6306743 (2001-10-01), Lee
patent: 6333250 (2001-12-01), Kim
patent: 6376325 (2002-04-01), Koo
patent: 6514842 (2003-02-01), Prall et al.
patent: 6555865 (2003-04-01), Lee et al.
patent: 6688584 (2004-02-01), Iyer et al.
patent: 6744108 (2004-06-01), Pan
patent: 6800543 (2004-10-01), Taguwa
patent: 6872639 (2005-03-01), DeBoer et al.
patent: 6875679 (2005-04-01), Agarwal
patent: 6902993 (2005-06-01), Blosse et al.
patent: 6911381 (2005-06-01), Agarwal et al.
patent: 6943416 (2005-09-01), Hu
patent: 2001/0054729 (2001-12-01), Divakaruni et al.
patent: 2002/0011636 (2002-01-01), Hayashi et al.
patent: 2002/0050644 (2002-05-01), Matsumoto et al.
patent: 2002/0072156 (2002-06-01), Lee et al.
patent: 2003/0043637 (2003-03-01), Forbes et al.
patent: 2003/0119251 (2003-06-01), Aggarwal et al.
patent: 2003/0170942 (2003-09-01), Taguwa
patent: 2004/0195603 (2004-10-01), Ito
patent: 2004/0207030 (2004-10-01), McTeer
patent: 2004/0219746 (2004-11-01), Vaartstra et al.
patent: 2005/0074957 (2005-04-01), Ho et al.
patent: 2005/0110058 (2005-05-01), Hu
patent: 2005/0124127 (2005-06-01), Ho et al.
patent: 2006/0024894 (2006-02-01), Hong
patent: 2006/0180875 (2006-08-01), Park et al.
patent: 2006/0197225 (2006-09-01), Pan et al.
patent: 2006/0244084 (2006-11-01), Lee et al.
patent: 2006/0284264 (2006-12-01), Taguwa
patent: 2007/0001241 (2007-01-01), Lim et al.
patent: 2007/0001246 (2007-01-01), Lim et al.
patent: 2007/0034964 (2007-02-01), Park et al.
patent: 2007/0066013 (2007-03-01), Lim et al.
patent: 2009/0149033 (2009-06-01), Vaartstra et al.
patent: 11-233451 (1999-08-01), None
patent: 1020020002176 (2002-01-01), None
patent: 1020020008771 (2002-01-01), None
patent: 1020050033494 (2005-04-01), None
patent: 100618895 (2006-08-01), None

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