Method for fabricating semiconductor device including...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S700000, C438S742000, C438S751000, C438S430000

Reexamination Certificate

active

07964463

ABSTRACT:
A method for fabricating a semiconductor device includes forming a plurality of pillar structures over a substrate, forming gate electrodes over sidewalls of the pillar structures, forming a sacrificial layer buried between the pillar structures, etching the sacrificial layer and the substrate to form trenches in the substrate, forming first inter-layer insulation patterns buried over the trenches and removing the remaining sacrificial layer at substantially the same time, and forming second inter-layer insulation patterns over the first inter-layer insulation patterns and buried between the pillar structures.

REFERENCES:
patent: 7368352 (2008-05-01), Kim et al.
patent: 7776694 (2010-08-01), Jang et al.
patent: 7858477 (2010-12-01), Kim
patent: 2009/0170302 (2009-07-01), Shin et al.
patent: 2009/0206443 (2009-08-01), Juengling
patent: 2009/0242971 (2009-10-01), Cho et al.
patent: 2009/0291551 (2009-11-01), Cho
patent: 2009/0294840 (2009-12-01), Gilgen et al.
patent: 2009/0317954 (2009-12-01), Kim
patent: 100618875 (2006-09-01), None
patent: 100660881 (2006-12-01), None
Notice of Preliminary Rejection issued from Korean Intellectual Property Office on Nov. 25, 2010.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for fabricating semiconductor device including... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for fabricating semiconductor device including..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for fabricating semiconductor device including... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2655938

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.