Method for fabricating semiconductor device comprising...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C438S230000, C438S232000

Reexamination Certificate

active

07666736

ABSTRACT:
After the implantation of fluorine ions into a semiconductor substrate, a gate insulating film, a gate electrode and a protective film are formed on the semiconductor substrate. Thereafter, fluorine ions are again implanted into the semiconductor substrate. Furthermore, p-type source/drain extension regions and source/drain regions are formed in the semiconductor substrate.

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Ambadi et al. (“Ambadi” Ambadi, Satheesh Tungsten and Tungsten Silicide (WSix) as Gate Materials for Trench MOSFETs Power Sem. Dev. And ICs 2000 Proc., The 12th Int. Symp. May 2000 pp. 181-184).
Essaian et al. (Essaian, Stepan “Fluorine Ion Implantation into Silicon Dioxide to Form Stable Low-k Intermetal Dielectric Films” 2000 IEEE pp. 330-333).
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Japanese Office Action, with English translation, issued in Japanese Patent Application No. JP 2005-255452, mailed Sep. 18, 2007.
Chinese Office Action, with English translation thereof, issued in Patent Application No. 200510120089.6 dated on Aug. 15, 2008.

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