Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
Reexamination Certificate
2006-02-21
2006-02-21
Chen, Jack (Department: 2813)
Semiconductor device manufacturing: process
Making field effect device having pair of active regions...
Having insulated gate
C438S585000
Reexamination Certificate
active
07001805
ABSTRACT:
A method for fabricating an n-type carbon nanotube device, characterized in that thermal annealing and plasma-enhanced chemical vapor-phased deposition (PECVD) are employed to form a non-oxide gate layer on a carbon nanotube device. Moreover, the inherently p-type carbon nanotube can be used to fabricate an n-type carbon nanotube device with reliable device characteristics and high manufacturing compatibility.
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Wind et al., “vertical scaling of carbon nanotube field-effect transistors using top gate electrode,” applied physics letter, vol. 80, pp. 3817-3819, May 2002.
Martel et al., “carbon nanotube field-effect transistors and logic circuits,” IEEE, pp. 94-98, Jun. 2002.
Chang et al., “ULSI technology,” pp. 211, 1996.
Martel et al., “Carbon nanotube field-effect transistors and logic circuits,” IEEE, pp. 94-98, Jun. 2002.
Kao Ming-Jer
Wang Hung-Hsiang
Wei Jeng-Hua
Bacon & Thomas PLLC
Chen Jack
Industrial Technology Research Institute
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