Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1994-09-29
1996-07-09
Simmons, David A.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
1562728, 156344, 1562722, 430256, 430262, B32B 3128
Patent
active
055340946
ABSTRACT:
A method and apparatus for releasing a workpiece from a substrate including providing a substrate which is transparent to a predetermined wavelength of electromagnetic radiation; forming, on the substrate, a separation layer which degrades in response to the predetermined radiation; providing the workpiece on the separation layer; and directing the predetermined radiation at the separation layer through the transparent substrate so as to degrade the separation layer and to separate the workpiece from the substrate.
REFERENCES:
patent: 3168402 (1965-02-01), Branibar
patent: 3884693 (1975-05-01), Bauer
patent: 3970494 (1976-07-01), Pritchard
patent: 4089684 (1978-05-01), Saeva
patent: 4211834 (1980-07-01), Lapadula
patent: 4348253 (1982-09-01), Subbarao
patent: 4357413 (1982-11-01), Cohen
patent: 4448636 (1984-05-01), Baber
patent: 4523102 (1985-06-01), Kazufumi
patent: 4544619 (1985-10-01), Christensen
patent: 4664739 (1987-05-01), Aurichiu
patent: 4743568 (1988-05-01), Wood
patent: 4751167 (1988-06-01), Yamagata
patent: 4774194 (1988-09-01), Hokuyou
patent: 4780177 (1988-10-01), Wojnarowski
patent: 4812191 (1989-03-01), Ho et al.
patent: 4847181 (1989-07-01), Shimokawa
patent: 4861425 (1989-08-01), Greer
patent: 5035981 (1991-07-01), Kurtz
patent: 5145764 (1992-09-01), Bauer
patent: 5223371 (1993-06-01), Ohta
patent: 5227277 (1993-07-01), Waterman
patent: 5244818 (1993-09-01), Jokerst
patent: 5264108 (1993-11-01), Mayer
IBM Technical Disclosure Bulletin, vol. 28, No. 5, Oct. 1985, by Donelon et al, p. 2034.
Arjavalingam Gnanalingam
Deutsch Alina
Doany Fuad E.
Furman Bruce K.
Hunt Donald J.
Helmer Steven J.
IBM Corporation
Simmons David A.
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